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Packaging of Electronics

CADMAXXBengaluru, Karnataka, IndiaPosted Today• Updated Today
Contract
Senior level
On-site

Salary

Not disclosed

Experience

7-15 Years

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Exp.: 7+ years

Location : Bangalore


1. Design and Development of Mechanical Packaging of Electronics unit for AIRBORNE and GROUND systems

2. Generate Electronic packaging designs data (3D and 2D CAD drawings) as per governing standards.

3. Manage design data in Product life cycle management (PLM) system like Team center

4. Generate Bill of material and other engineering documentation (Reports Etc.)

5. Work closely with ECAD, MCAD and Electronics Design Team

6. Conduct / Contribute to design reviews (Functional, Cross-Functional : Internal , External) per defined product development process.

7. Generate and manage work breakdown plan for allocated project or task. Support project management in plan development with proper estimates and timelines.

8. Provide engineering support during different product lifecycle phases : Prototyping, Manufacturing, In-service Etc.

9. Support configuration management activities for design upgrades and releases.

10. Support / Perform developmental testing, qualification and certification of the product.

11. Support internal and external audits.

12. Test Engineering Support. 

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Required Skills
Design
AIRBORNE
GROUND systems
Packaging of Electronics